Issued Patents All Time
Showing 26–50 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444045 | Bonding structures of semiconductor devices | Ramasamy Chockalingam, Xiaodong Li, Kai Chong Chan, Ranjan Rajoo | 2022-09-13 |
| 11289649 | Non-volatile memory elements with a narrowed electrode | Lup San Leong, Curtis Chun-I Hsieh, Eng Huat Toh, Kin Wai Tang | 2022-03-29 |
| 11276460 | Dye-sensitized optoelectronic memory | Jianxun Sun, Tu Pei Chen, Eng Huat Toh | 2022-03-15 |
| 11270938 | Semiconductor devices and methods of forming semiconductor devices | Kai Kang, Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi | 2022-03-08 |
| 11244915 | Bond pads of semiconductor devices | Ramasamy Chockalingam, Chee Kong Leong, Ranjan Rajoo, Xuesong Rao, Xiaodong Li | 2022-02-08 |
| 11233195 | Memory devices and methods of forming memory devices | Curtis Chun-I Hsieh, Wei-Hui Hsu, Yi Jiang, Kai Kang, Wanbing Yi | 2022-01-25 |
| 11217496 | Test pad with crack stop protection | Ramasamy Chockalingam, Wanbing Yi | 2022-01-04 |
| 11205478 | Memory device and a method for forming the memory device | Lanxiang Wang, Shyue Seng Tan, Eng Huat Toh | 2021-12-21 |
| 11127784 | Integrated circuits with embedded memory structures and methods for fabricating the same | Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang | 2021-09-21 |
| 11127459 | Memory devices and methods of forming the same | Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang, Kai Kang | 2021-09-21 |
| 11094585 | Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product | Xuan Anh Tran, Eswar Ramanathan, Sunil Kumar Singh, Suryanarayana Kalaga, Suresh Kumar Regonda | 2021-08-17 |
| 11081523 | Memory devices and methods of forming memory devices | Curtis Chun-I Hsieh, Wei-Hui Hsu, Yi Jiang, Wanbing Yi | 2021-08-03 |
| 11031251 | Self-aligned planarization of low-k dielectrics and method for producing the same | Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang, Zhehui Wang | 2021-06-08 |
| 11018093 | Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same | Bharat Bhushan, Boo Yang Jung, Wanbing Yi, Danny Pak-Chum Shum | 2021-05-25 |
| 10892239 | Bond pad reliability of semiconductor devices | Ramasamy Chockalingam, Ian Melville | 2021-01-12 |
| 10777519 | Reliable passivation for integrated circuits | Fook Hong Lee, Ee Jan Khor | 2020-09-15 |
| 10734572 | Device with capping layer for improved residue defect and method of production thereof | Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi | 2020-08-04 |
| 10734444 | Integrated circuits with integrated memory structures and capacitors and methods for fabricating the same | Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi | 2020-08-04 |
| 10720580 | RRAM device and method of fabrication thereof | Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang | 2020-07-21 |
| 10707358 | Selective shielding of ambient light at chip level | Wanbing Yi, Kiok Boone Elgin Quek, Khee Yong Lim, Chim Seng Seet, Rajesh S. Nair | 2020-07-07 |
| 10693054 | MTJ bottom metal via in a memory cell and method for producing the same | Danny Pak-Chum Shum, Wanbing Yi, Curtis Chun-I Hsieh, Yi Jiang, Benfu Lin | 2020-06-23 |
| 10658316 | Bond pad reliability of semiconductor devices | Xiaodong Li, Ramasamy Chockalingam | 2020-05-19 |
| 10651380 | Memory devices and methods of forming the same | Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang | 2020-05-12 |
| 10636867 | Metal-insulator-poly capacitor in a high-K metal gate process and method of manufacturing | Xinshu Cai, Shyue Seng Tan, Danny Pak-Chum Shum | 2020-04-28 |
| 10608046 | Integrated two-terminal device with logic device for embedded application | Wanbing Yi, Curtis Chun-I Hsieh, Soh Yun Siah, Hai Cong, Alex See +3 more | 2020-03-31 |