Issued Patents All Time
Showing 76–100 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170437 | Via disguise to protect the security product from delayering and graphic design system (GDS) hacking and method for producing the same | Ramasamy Chockalingam, Sung Mun Jung, Wenhu Liu, Ee Jan Khor | 2019-01-01 |
| 10158066 | Two pass MRAM dummy solution | Wanbing Yi, Neha Nayyar, Curtis Chun-I Hsieh, Mahesh Bhatkar, Wenjun Liu | 2018-12-18 |
| 10128201 | Seal ring for wafer level package | Shunqiang Gong, Shan Gao | 2018-11-13 |
| 10121964 | Integrated magnetic random access memory with logic device | Yi Jiang, Daxiang Wang, Fan Zhang, Francis Poh, Danny Pak-Chum Shum | 2018-11-06 |
| 10121755 | Robust chamfer design for seal ring | Mahesh Bhatkar, Wanbing Yi | 2018-11-06 |
| 10096768 | Magnetic shielding for MTJ device or bit | Yi Jiang, Bharat Bhushan, Wanbing Yi, Pak-Chum Danny Shum | 2018-10-09 |
| 10062641 | Integrated circuits including a dummy metal feature and methods of forming the same | Haifeng Sheng, Shifeng Zhao, Soh Yun Siah | 2018-08-28 |
| 9972775 | Integrated magnetic random access memory with logic device having low-k interconnects | Danny Pak-Chum Shum, Yi Jiang, Wanbing Yi, Francis Poh, Hai Cong | 2018-05-15 |
| 9929165 | Method for producing integrated circuit memory cells with less dedicated lithographic steps | Laiqiang Luo, Yu Jin Eugene Kong, Daxiang Wang, Fan Zhang, Danny Pak-Chum Shum +4 more | 2018-03-27 |
| 9917027 | Integrated circuits with aluminum via structures and methods for fabricating the same | Wanbing Yi, Mahesh Bhatkar, Chin Chuan Neo | 2018-03-13 |
| 9905282 | Top electrode dome formation | Wanbing Yi, Curtis Chun-I Hsieh, Soh Yun Siah | 2018-02-27 |
| 9881844 | Integrated circuits with copper hillock-detecting structures and methods for detecting copper hillocks using the same | Wanbing Yi, Wei Shao, Gong Shun Qiang | 2018-01-30 |
| 9875971 | Magnetic shielding of MRAM package | Bharat Bhushan, Wanbing Yi | 2018-01-23 |
| 9865649 | Integrated two-terminal device and logic device with compact interconnects having shallow via for embedded application | Wanbing Yi, Yi Jiang, Curtis Chun-I Hsieh, Danny Pak-Chum Shum | 2018-01-09 |
| 9847272 | Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures | Wei Liu, Kheng Chok Tee, Kam Chew Leong | 2017-12-19 |
| 9837334 | Programmable active cooling device | Kheng Chok Tee, Wei Liu, Kam Chew Leong | 2017-12-05 |
| 9806128 | Interposers for integrated circuits with multiple-time programming and methods for manufacturing the same | Yi Jiang, Danny Pak-Chum Shum, Shunqiang Gong | 2017-10-31 |
| 9799571 | Methods for producing integrated circuits with interposers and integrated circuits produced from such methods | Shunqiang Gong | 2017-10-24 |
| 9793185 | Test structure for monitoring liner oxidation | Wanbing Yi, Daxiang Wang, Kemao Lin, Shaoqiang Zhang | 2017-10-17 |
| 9793208 | Plasma discharge path | Haifeng Sheng, Wanbing Yi, Daxiang Wang, Soh Yun Siah | 2017-10-17 |
| 9786839 | 3D MRAM with through silicon vias or through silicon trenches magnetic shielding | Bharat Bhushan, Wanbing Yi, Pak-Chum Danny Shum | 2017-10-10 |
| 9773702 | Device without zero mark layer | Shunqiang Gong, Shijie Wang, Mahesh Bhatkar, Daxiang Wang | 2017-09-26 |
| 9728474 | Semiconductor chips with seal rings and electronic test structures, semiconductor wafers including the semiconductor chips, and methods for fabricating the same | Wanbing Yi, Mahesh Bhatkar, Danny Pak-Chum Shum | 2017-08-08 |
| 9711662 | Integrated circuits with optical modulators and photodetectors and methods for producing the same | Shunqiang Gong, Benfu Lin, Ramakanth Alapati | 2017-07-18 |
| 9679905 | Integrated circuits with non-volatile memory and methods of producing the same | Laiqiang Luo, Yew Tuck Chow, Fan Zhang, Huajun Liu, Dong Wang +1 more | 2017-06-13 |