Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847272 | Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures | Juan Boon Tan, Wei Liu, Kheng Chok Tee | 2017-12-19 |
| 9837334 | Programmable active cooling device | Kheng Chok Tee, Juan Boon Tan, Wei Liu | 2017-12-05 |
| 9196544 | Integrated circuits with stressed semiconductor-on-insulator (SOI) body contacts and methods for fabricating the same | Kheng Chok Tee, Meijun Lu | 2015-11-24 |
| 6277710 | Method of forming shallow trench isolation | Hyun Tae Kim, Elgin Quek | 2001-08-21 |