Issued Patents All Time
Showing 76–100 of 230 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7550842 | Integrated circuit assembly | Igor Y. Khandros, Charles A. Miller, A. Nicholas Sporck, Gary W. Grube, Gaetan L. Mathieu | 2009-06-23 |
| 7548055 | Testing an electronic device using test data from a plurality of testers | Igor Y. Khandros, Charles A. Miller, A. Nicholas Sporck | 2009-06-16 |
| 7534654 | Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component | David V. Pedersen, Igor Y. Khandros | 2009-05-19 |
| 7524194 | Lithographic type microelectronic spring structures with improved contours | Stuart Wenzel | 2009-04-28 |
| 7498825 | Probe card assembly with an interchangeable probe insert | Carl V. Reynolds, Nobuhiro Kawamata, Takao Saeki | 2009-03-03 |
| 7488917 | Electric discharge machining of a probe array | Gaetan L. Mathieu, Gary W. Grube | 2009-02-10 |
| 7482822 | Apparatus and method for limiting over travel in a probe card assembly | Timothy E. Cooper, Carl V. Reynolds, Ravindra V. Shenoy | 2009-01-27 |
| 7471094 | Method and apparatus for adjusting a multi-substrate probe structure | Eric D. Hobbs, Lunyu Ma, Gaetan L. Mathieu, Steven T. Murphy, Makarand Shinde +1 more | 2008-12-30 |
| 7463043 | Methods of probing an electronic device | Timothy E. Cooper, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu | 2008-12-09 |
| 7458816 | Shaped spring | Gaetan L. Mathieu, Stuart Wenzel | 2008-12-02 |
| 7459795 | Method to build a wirebond probe card in a many at a time fashion | Bruce Barbara | 2008-12-02 |
| 7455540 | Electrical contactor, especially wafer level contactor, using fluid pressure | — | 2008-11-25 |
| 7435108 | Variable width resilient conductive contact structures | Gaetan L. Mathieu | 2008-10-14 |
| 7400157 | Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng | 2008-07-15 |
| 7396236 | Wafer level interposer | Carl V. Reynolds | 2008-07-08 |
| 7385411 | Method of designing a probe card apparatus with desired compliance characteristics | — | 2008-06-10 |
| 7371072 | Spring interconnect structures | Gaetan L. Mathieu, Gary W. Grube, Richard A. Larder | 2008-05-13 |
| 7352196 | Probe card assembly and kit | Igor Y. Khandros, A. Nicholas Sporck | 2008-04-01 |
| 7347702 | Contact carriers (tiles) for populating larger substrates with spring contacts | Thomas H. Dozier, II, Igor Y. Khandros, Gaetan L. Mathieu, William D. Smith | 2008-03-25 |
| 7342405 | Apparatus for reducing power supply noise in an integrated circuit | Charles A. Miller | 2008-03-11 |
| 7335057 | High density planar electrical interface | Charles A. Miller | 2008-02-26 |
| 7325302 | Method of forming an interconnection element | Gaetan L. Mathieu | 2008-02-05 |
| 7312618 | Method and system for compensating thermally induced motion of probe cards | Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu | 2007-12-25 |
| 7287322 | Lithographic contact elements | Gaetan L. Mathieu, Gary W. Grube | 2007-10-30 |
| 7285968 | Apparatus and method for managing thermally induced motion of a probe card assembly | Gary W. Grube, Eric D. Hobbs, Gaetan L. Mathieu, Makarand Shinde, Alexander H. Slocum +2 more | 2007-10-23 |