| 7990164 |
Method of designing a probe card apparatus with desired compliance characteristics |
— |
2011-08-02 |
$5,245,000 |
| 7977956 |
Method and apparatus for probe card alignment in a test system |
Keith J. Breinlinger, Eric D. Hobbs, Douglas S. Ondricek |
2011-07-12 |
$1,702,000 |
| 7967621 |
Electrical contactor, especially wafer level contactor, using fluid pressure |
— |
2011-06-28 |
$5,052,000 |
| 7956633 |
Stacked guard structures |
— |
2011-06-07 |
$2,637,000 |
| 7952375 |
AC coupled parameteric test probe |
A. Nicholas Sporck, Charles A. Miller |
2011-05-31 |
$5,633,000 |
| 7948252 |
Multilayered probe card |
Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng |
2011-05-24 |
$5,593,000 |
| 7936177 |
Providing an electrically conductive wall structure adjacent a contact structure of an electronic device |
Keith J. Breinlinger, David Pritzkau |
2011-05-03 |
$5,965,000 |
| 7930219 |
Method and system for designing a probe card |
Mark W. Brandemuehl, Stefan Graef, Yves Parent |
2011-04-19 |
$2,995,000 |
| 7920989 |
Remote test facility with wireless interface to local test facilities |
Igor Y. Khandros |
2011-04-05 |
$6,205,000 |
| 7898242 |
Probe card assembly with an interchangeable probe insert |
Carl V. Reynolds, Nobuhiro Kawamata, Takao Saeki |
2011-03-01 |
$2,831,000 |
| 7897435 |
Re-assembly process for MEMS structures |
Gaetan L. Mathieu |
2011-03-01 |
$2,831,000 |
| 7884006 |
Method to build a wirebond probe card in a many at a time fashion |
Bruce Barbara |
2011-02-08 |
$2,650,000 |
| 7880489 |
Printing of redistribution traces on electronic component |
Yoshikazu Hatsukano, Igor Y. Khandros, Gaetan L. Mathieu |
2011-02-01 |
$2,595,000 |
| 7868632 |
Composite motion probing |
Timothy E. Cooper, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu |
2011-01-11 |
$5,253,000 |
| 7852094 |
Sharing resources in a system for testing semiconductor devices |
Matthew Chraft, Roy J. Henson, A. Nicholas Sporck |
2010-12-14 |
$2,427,000 |
| 7845072 |
Method and apparatus for adjusting a multi-substrate probe structure |
Eric D. Hobbs, Lunyu Ma, Gaetan L. Mathieu, Steven T. Murphy, Makarand Shinde +1 more |
2010-12-07 |
$5,601,000 |
| 7841863 |
Spring interconnect structures |
Gaetan L. Mathieu, Gary W. Grube, Richard A. Larder |
2010-11-30 |
$2,583,000 |
| 7825674 |
Probe card configuration for low mechanical flexural strength electrical routing substrates |
Makarand Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy |
2010-11-02 |
$1,930,000 |
| 7821255 |
Test system with wireless communications |
Igor Y. Khandros, Charles A. Miller, A. Nicholas Sporck |
2010-10-26 |
$5,038,000 |
| 7808259 |
Component assembly and alignment |
Eric D. Hobbs, Gaetan L. Mathieu |
2010-10-05 |
$4,173,000 |
| 7798822 |
Microelectronic contact structures |
Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu |
2010-09-21 |
$4,372,000 |
| 7737709 |
Methods for planarizing a semiconductor contactor |
Gaetan L. Mathieu, Gary W. Grube |
2010-06-15 |
$5,280,000 |
| 7732713 |
Method to build robust mechanical structures on substrate surfaces |
Gary W. Grube, Gaetan L. Mathieu, Chadwick D. Sofield |
2010-06-08 |
$942,000 |
| 7733106 |
Apparatus and method of testing singulated dies |
Thomas H. Dozier, II, David S. Y. Hsu, Igor Y. Khandros, Charles A. Miller |
2010-06-08 |
$942,000 |
| 7731503 |
Carbon nanotube contact structures |
John K. Gritters, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu |
2010-06-08 |
$942,000 |
