| 8203351 |
Probing apparatus with guarded signal traces |
Benjamin N. Eldridge, Takao Saeki, Yoichi Urakawa |
2012-06-19 |
| 7898242 |
Probe card assembly with an interchangeable probe insert |
Benjamin N. Eldridge, Nobuhiro Kawamata, Takao Saeki |
2011-03-01 |
| 7843202 |
Apparatus for testing devices |
Eric D. Hobbs, Nobuhiro Kawamata, Andrew W. McFarland, Yoichi Urakawa |
2010-11-30 |
| 7724004 |
Probing apparatus with guarded signal traces |
Benjamin N. Eldridge, Takao Saeki, Yoichi Urakawa |
2010-05-25 |
| 7649368 |
Wafer level interposer |
Benjamin N. Eldridge |
2010-01-19 |
| 7498825 |
Probe card assembly with an interchangeable probe insert |
Benjamin N. Eldridge, Nobuhiro Kawamata, Takao Saeki |
2009-03-03 |
| 7482822 |
Apparatus and method for limiting over travel in a probe card assembly |
Timothy E. Cooper, Benjamin N. Eldridge, Ravindra V. Shenoy |
2009-01-27 |
| 7479792 |
Methods for making plated through holes usable as interconnection wire or probe attachments |
Gaetan L. Mathieu, Igor Y. Khandros |
2009-01-20 |
| 7396236 |
Wafer level interposer |
Benjamin N. Eldridge |
2008-07-08 |
| 7330039 |
Method for making a socket to perform testing on integrated circuits |
Igor Y. Khandros, Gaetan L. Mathieu |
2008-02-12 |
| 7128587 |
Probe card covering system and method |
Benjamin N. Eldridge |
2006-10-31 |
| 7084650 |
Apparatus and method for limiting over travel in a probe card assembly |
Timothy E. Cooper, Benjamin N. Eldridge, Ravindra V. Shenoy |
2006-08-01 |
| 7047638 |
Method of making microelectronic spring contact array |
Benjamin N. Eldridge, Gaetan L. Mathieu |
2006-05-23 |
| 7024763 |
Methods for making plated through holes usable as interconnection wire or probe attachments |
Gaetan L. Mathieu, Igor Y. Khandros |
2006-04-11 |
| 6960923 |
Probe card covering system and method |
Benjamin N. Eldridge |
2005-11-01 |
| 6920689 |
Method for making a socket to perform testing on integrated circuits |
Igor Y. Khandros, Gaetan L. Mathieu |
2005-07-26 |
| 6090237 |
Apparatus for restraining adhesive overflow in a multilayer substrate assembly during lamination |
Alex M. Neussendorfer, Jeffrey K. Kennedy |
2000-07-18 |