Issued Patents All Time
Showing 101–125 of 230 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7262611 | Apparatuses and methods for planarizing a semiconductor contactor | Gaetan L. Mathieu, Gary W. Grube | 2007-08-28 |
| 7253651 | Remote test facility with wireless interface to local test facilities | Igor Y. Khandros | 2007-08-07 |
| 7251884 | Method to build robust mechanical structures on substrate surfaces | Gary W. Grube, Gaetan L. Mathieu, Chadwick D. Sofield | 2007-08-07 |
| 7245137 | Test head assembly having paired contact structures | Stuart Wenzel | 2007-07-17 |
| 7245120 | Predictive, adaptive power supply for an integrated circuit under test | Charles A. Miller | 2007-07-17 |
| 7230437 | Mechanically reconfigurable vertical tester interface for IC probing | Barbara Vasquez, Makarand Shinde, Gaetan L. Mathieu, A. Nicholas Sporck | 2007-06-12 |
| 7225538 | Resilient contact structures formed and then attached to a substrate | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2007-06-05 |
| 7218127 | Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component | Timothy E. Cooper, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu | 2007-05-15 |
| 7218094 | Wireless test system | Igor Y. Khandros, A. Nicholas Sporck, Charles A. Miller | 2007-05-15 |
| 7204008 | Method of making an electronics module | — | 2007-04-17 |
| 7202687 | Systems and methods for wireless semiconductor device testing | Igor Y. Khandros, Charles A. Miller, A. Nicholas Sporck | 2007-04-10 |
| 7202682 | Composite motion probing | Timothy E. Cooper, Igor Y. Khandros, Rod Martens, Gaetan L. Mathieu | 2007-04-10 |
| 7202677 | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component | David V. Pedersen, Igor Y. Khandros | 2007-04-10 |
| 7195503 | Electrical contactor, especially wafer level contactor, using fluid pressure | — | 2007-03-27 |
| 7196531 | Method of manufacturing a probe card | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Poya Lotfizadeh, Jim Chih-Chiang Tseng | 2007-03-27 |
| 7189077 | Lithographic type microelectronic spring structures with improved contours | Stuart Wenzel | 2007-03-13 |
| 7179662 | Semiconductor fuse covering | — | 2007-02-20 |
| 7169646 | Interconnect assemblies and methods | — | 2007-01-30 |
| 7168162 | Method of manufacturing a probe card | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2007-01-30 |
| 7142000 | Mounting spring elements on semiconductor devices, and wafer-level testing methodology | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2006-11-28 |
| 7140883 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Gaetan L. Mathieu, Thomas H. Dozier, II, William D. Smith | 2006-11-28 |
| 7128587 | Probe card covering system and method | Carl V. Reynolds | 2006-10-31 |
| 7127811 | Methods of fabricating and using shaped springs | Gaetan L. Mathieu, Stuart Wenzel | 2006-10-31 |
| 7122760 | Using electric discharge machining to manufacture probes | Gaetan L. Mathieu, Gary W. Grube | 2006-10-17 |
| 7119564 | Method and system for compensating thermally induced motion of probe cards | Rod Martens, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde +1 more | 2006-10-10 |