Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842555 | Integrated transistor module and method of fabricating same | Jonathan Almeria Noquil, Consuelo Tangpuz | 2010-11-30 |
| 7821124 | Thin, thermally enhanced flip chip in a leaded molded package | Chung-Lin Wu | 2010-10-26 |
| 7790513 | Substrate based unmolded package | — | 2010-09-07 |
| 7772681 | Semiconductor die package and method for making the same | Chung-Lin Wu, Venkat Iyer | 2010-08-10 |
| 7682877 | Substrate based unmolded package | Jonathan Almeria Noquil, Consuelo Tangpuz | 2010-03-23 |
| 7632719 | Wafer-level chip scale package and method for fabricating and using the same | Seung-yong Choi, Min-hyo Park, Ji Hwan Kim | 2009-12-15 |
| 7618896 | Semiconductor die package including multiple dies and a common node structure | Venkat Iyer, Jonathan Klein | 2009-11-17 |
| 7582956 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2009-09-01 |
| 7537958 | High performance multi-chip flip chip package | — | 2009-05-26 |
| 7525179 | Lead frame structure with aperture or groove for flip chip in a leaded molded package | Chung-Lin Wu | 2009-04-28 |
| 7504281 | Substrate based unmolded package | — | 2009-03-17 |
| 7501702 | Integrated transistor module and method of fabricating same | Jonathan Almeria Noquil, Consuelo Tangpuz | 2009-03-10 |
| 7501337 | Dual metal stud bumping for flip chip applications | Consuelo Tangpuz, Margie T. Rios, Erwin Victor Cruz | 2009-03-10 |
| 7468548 | Thermal enhanced upper and dual heat sink exposed molded leadless package | Chung-Lin Wu | 2008-12-23 |
| 7439613 | Substrate based unmolded package | Jonathan Almeria Noquil, Consuelo Tangpuz | 2008-10-21 |
| 7393718 | Unmolded package for a semiconductor device | — | 2008-07-01 |
| 7335532 | Method of assembly for multi-flip chip on lead frame on overmolded IC package | Jonathan Almeria Noquil, Seung-yong Choi, Chung-Lin Wu | 2008-02-26 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region | Chung-Lin Wu | 2008-02-19 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad | Yoon-hwa Choi, Shi-baek Nam, O-seob Jeon, Maria Cristina Estacio | 2008-01-01 |
| 7271497 | Dual metal stud bumping for flip chip applications | Consuelo Tangpuz, Margie T. Rios, Erwin Victor Cruz | 2007-09-18 |
| 7256479 | Method to manufacture a universal footprint for a package with exposed chip | Jonathan Almeria Noquil, Connie Tangpuz, Romel N. Manatad, Stephen R. Martin, Venkat Iyer | 2007-08-14 |
| 7215011 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2007-05-08 |
| 7196313 | Surface mount multi-channel optocoupler | Maria Clemens Y. Quinones | 2007-03-27 |
| 7154186 | Multi-flip chip on lead frame on over molded IC package and method of assembly | Jonathan Almeria Noquil, Seung-yong Choi, Chung-Lin Wu | 2006-12-26 |
| 7154168 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2006-12-26 |