Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7101734 | Flip chip substrate design | Honorio T. Granada, Jr., Connie Tangpuz | 2006-09-05 |
| 7081666 | Lead frame structure with aperture or groove for flip chip in a leaded molded package | Chung-Lin Wu | 2006-07-25 |
| 7061077 | Substrate based unmolded package including lead frame structure and semiconductor die | — | 2006-06-13 |
| 7029947 | Flip chip in leaded molded package with two dies | — | 2006-04-18 |
| 7022548 | Method for making a semiconductor die package | Chung-Lin Wu | 2006-04-04 |
| 7008868 | Passivation scheme for bumped wafers | — | 2006-03-07 |
| 6992384 | High performance multi-chip flip chip package | — | 2006-01-31 |
| 6953998 | Unmolded package for a semiconductor device | — | 2005-10-11 |
| 6949410 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2005-09-27 |
| 6891256 | Thin, thermally enhanced flip chip in a leaded molded package | Chung-Lin Wu | 2005-05-10 |
| 6867481 | Lead frame structure with aperture or groove for flip chip in a leaded molded package | Chung-Lin Wu | 2005-03-15 |
| 6836023 | Structure of integrated trace of chip package | Chung-Lin Wu | 2004-12-28 |
| 6806580 | Multichip module including substrate with an array of interconnect structures | Maria Cristina Estacio | 2004-10-19 |
| 6798044 | Flip chip in leaded molded package with two dies | — | 2004-09-28 |
| 6753605 | Passivation scheme for bumped wafers | — | 2004-06-22 |
| 6731003 | Wafer-level coated copper stud bumps | Consuelo Tangpuz, Erwin Victor Cruz | 2004-05-04 |
| 6720642 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2004-04-13 |
| 6696321 | High performance multi-chip flip chip package | — | 2004-02-24 |
| 6683375 | Semiconductor die including conductive columns | Chung-Lin Wu | 2004-01-27 |
| 6661082 | Flip chip substrate design | Honorio T. Granada, Jr., Connie Tangpuz | 2003-12-09 |
| 6633030 | Surface mountable optocoupler package | — | 2003-10-14 |
| 6627991 | High performance multi-chip flip package | — | 2003-09-30 |
| 6566749 | Semiconductor die package with improved thermal and electrical performance | Steven Sapp | 2003-05-20 |
| 6489678 | High performance multi-chip flip chip package | — | 2002-12-03 |
| 6469384 | Unmolded package for a semiconductor device | — | 2002-10-22 |