Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11405741 | Method and system for handling global transitions between listening positions in a virtual reality environment | Leon Terentiv, Christof Fersch | 2022-08-02 |
| 11375332 | Methods, apparatus and systems for three degrees of freedom (3DoF+) extension of MPEG-H 3D audio | Christof Fersch, Leon Terentiv | 2022-06-28 |
| 11109178 | Method and system for handling local transitions between listening positions in a virtual reality environment | Leon Terentiv, Christof Fersch | 2021-08-31 |
| 10814430 | Systems and methods for additive manufacturing flow control devices | Christian Thomas Wakelam, Rene du Cauze de Nazelle, Hannes Haderlein, Viktor Engel, Florian Hoefler +1 more | 2020-10-27 |
| 10614824 | Audio decoder, apparatus for generating encoded audio output data and methods permitting initializing a decoder | Bernd Czelhan, Max Neuendorf, Nikolaus Rettelbach, Ingo Hofmann, Harald Fuchs +2 more | 2020-04-07 |
| 10375134 | Method and device for low latency group-addressed streaming | Rafael CAUDURO DIAS DE PAIVA | 2019-08-06 |
| 10332536 | Apparatus and method for decoding an encoded audio signal with low computational resources | Andreas Niedermeier, Stephan Wilde, Matthias Hildenbrand, Marc Gayer, Max Neuendorf | 2019-06-25 |
| 10229694 | Audio decoder, apparatus for generating encoded audio output data and methods permitting initializing a decoder | Bernd Czelhan, Max Neuendorf, Nikolaus Rettelbach, Ingo Hofmann, Harald Fuchs +2 more | 2019-03-12 |
| 10185312 | Insitu tool health and recipe quality monitoring on a CDSEM | Yvonne Jänicke, Stephan Melzig, Alexander Ullrich, Martin Pilz | 2019-01-22 |
| 10115621 | Method for in-die overlay control using FEOL dummy fill layer | Peter Moll, Martin Schmidt, Carsten Hartig, Matthias Ruhm, Stefan Thierbach +3 more | 2018-10-30 |
| 9928845 | Audio decoder, apparatus for generating encoded audio output data and methods permitting initializing a decoder | Bernd Czelhan, Max Neuendorf, Nikolaus Rettelbach, Ingo Hofmann, Harald Fuchs +2 more | 2018-03-27 |
| 9799345 | Apparatus and method for decoding an encoded audio signal with low computational resources | Andreas Niedermeier, Stephan Wilde, Matthias Hildenbrand, Marc Gayer, Max Neuendorf | 2017-10-24 |
| 9171765 | Inline residual layer detection and characterization post via post etch using CD-SEM | Carsten Hartig | 2015-10-27 |
| 9091667 | Detection of particle contamination on wafers | Adam Michal Urbanowicz, Carsten Hartig | 2015-07-28 |
| 9006681 | Method of depositing protective structures | Heinz Wanzenboeck, Wolfram Buehler, Holger Doemer, Carl Kuebler, Gottfried Hochleitner +1 more | 2015-04-14 |
| 8575041 | Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatment | Matthias Schaller, Thomas Oszinda | 2013-11-05 |
| 8440579 | Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification | Matthias Schaller, Thomas Oszinda | 2013-05-14 |
| 8423320 | Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models | Matthias Schaller, Thomas Oszinda, Christin Bartsch | 2013-04-16 |
| 8399358 | Establishing a hydrophobic surface of sensitive low-k dielectrics of microstructure devices by in situ plasma treatment | Matthias Schaller | 2013-03-19 |
| 8338293 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Matthias Schaller | 2012-12-25 |
| 8143594 | Method of depositing protective structures | Heinz Wanzenboeck, Wolfram Buehler, Holger Doemer, Carl Kuebler, Gottfried Hochleitner +1 more | 2012-03-27 |
| 8110498 | Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device | Matthias Schaller, Susanne Leppack | 2012-02-07 |
| 8062982 | High yield plasma etch process for interlayer dielectrics | Matthias Schaller, Matthias Lehr, Kornelia Dittmar | 2011-11-22 |
| 7986040 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Matthias Schaller | 2011-07-26 |
| 7498266 | Method for structuring of silicon substrates for microsystem technological device elements and associated silicon substrate | Karola Richter | 2009-03-03 |