Issued Patents All Time
Showing 101–125 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7843060 | Droop-free high output light emitting devices and methods of fabricating and operating same | — | 2010-11-30 |
| 7795623 | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures | David T. Emerson, Kevin Haberern, Michael John Bergmann, David B. Slater, Jr., Matthew Donofrio | 2010-09-14 |
| 7791061 | External extraction light emitting diode based upon crystallographic faceted surfaces | David B. Slater, Jr., Hua-Shuang Kong, Matthew Donofrio | 2010-09-07 |
| 7737459 | High output group III nitride light emitting diodes | Michael John Bergmann, David T. Emerson, Kevin Haberern | 2010-06-15 |
| D616839 | LED chip | David B. Slater, Jr., Amber Christine Salter, Ashay Chitnis, James Ibbetson, Bernd Keller | 2010-06-01 |
| 7692209 | Group III nitride LED with undoped cladding layer | Kathleen Marie Doverspike, Hua-Shuang Kong, Michael John Bergmann | 2010-04-06 |
| 7675068 | Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices | Davis Andrew McClure, Alexander Suvorov, David B. Slater, Jr. | 2010-03-09 |
| 7642121 | LED bonding structures and methods of fabricating LED bonding structures | David B. Slater, Jr. | 2010-01-05 |
| 7611915 | Methods of manufacturing light emitting diodes including barrier layers/sublayers | David B. Slater, Jr., Bradley E. Williams, Peter Scott Andrews, Scott Allen | 2009-11-03 |
| 7608860 | Light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., Jayesh Bharathan, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2009-10-27 |
| D602450 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2009-10-20 |
| D593968 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2009-06-09 |
| 7531840 | Light emitting diode with metal coupling structure | Kathleen Marie Doverspike, Michael John Bergmann, Hua-Shuang Kong | 2009-05-12 |
| 7482183 | Light emitting diode with degenerate coupling structure | Kathleen Marie Doverspike, Michael John Bergmann, Hua-Shuang Kong | 2009-01-27 |
| 7473938 | Robust Group III light emitting diode for high reliability in standard packaging applications | Brian Thibeault, David B. Slater, Jr., Gerald H. Negley, Van Mieczkowski | 2009-01-06 |
| D583338 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2008-12-23 |
| D582865 | LED chip | David B. Slater, Jr., Amber Christine Salter, Ashay Chitnis, James Ibbetson, Bernd Keller | 2008-12-16 |
| D582866 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2008-12-16 |
| 7462861 | LED bonding structures and methods of fabricating LED bonding structures | David B. Slater, Jr. | 2008-12-09 |
| 7402837 | Light emitting devices with self aligned ohmic contacts | David B. Slater, Jr., Ian Hamilton | 2008-07-22 |
| D566056 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Kevin Haberern | 2008-04-08 |
| D566057 | LED chip | James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson, Kevin Haberern | 2008-04-08 |
| 7341175 | Bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., Jayesh Bharathan, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2008-03-11 |
| 7332365 | Method for fabricating group-III nitride devices and devices fabricated using method | Shuji Nakamura, Steven P. DenBaars, Chuck Swoboda, Umesh Mishra | 2008-02-19 |
| 7294859 | Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices | Davis Andrew McClure, Alexander Suvorov, David B. Slater, Jr. | 2007-11-13 |