| 10873002 |
Permanent wafer bonding using metal alloy preform discs |
— |
2020-12-22 |
| 10211296 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate |
Stephan Lutgen, Saad Murad |
2019-02-19 |
| 10199360 |
Wire bond free wafer level LED |
Bernd Keller, Nicholas W. Medendorp, Jr., James Ibbetson, Max Batres |
2019-02-05 |
| 10026814 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate |
Stephan Lutgen, Saad Murad |
2018-07-17 |
| 9786744 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate |
Stephan Lutgen, Saad Murad |
2017-10-10 |
| 9634191 |
Wire bond free wafer level LED |
Bernd Keller, Nicholas W. Medendorp, Jr., James Ibbetson, Max Batres |
2017-04-25 |
| 9496349 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate |
Stephan Lutgen, Saad Murad |
2016-11-15 |
| 9368428 |
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management |
James Ibbetson |
2016-06-14 |
| 9196799 |
LED chips having fluorescent substrates with microholes and methods for fabricating |
Bernd Keller |
2015-11-24 |
| 9159888 |
Wafer level phosphor coating method and devices fabricated utilizing method |
James Ibbetson, Bernd Keller, David T. Emerson, John Edmond, Michael John Bergmann +6 more |
2015-10-13 |
| 9024349 |
Wafer level phosphor coating method and devices fabricated utilizing method |
James Ibbetson, Arpan Chakraborty, Eric Tarsa, Bernd Keller, James Seruto +1 more |
2015-05-05 |
| 8877524 |
Emission tuning methods and devices fabricated utilizing methods |
John Edmond, Jeffrey Carl Britt, Bernd Keller, David T. Emerson, Michael John Bergmann +1 more |
2014-11-04 |
| 8878219 |
Flip-chip phosphor coating method and devices fabricated utilizing method |
James Ibbetson, Bernd Keller |
2014-11-04 |
| 8617997 |
Selective wet etching of gold-tin based solder |
— |
2013-12-31 |
| 8021904 |
Ohmic contacts to nitrogen polarity GaN |
— |
2011-09-20 |
| 7982363 |
Bulk acoustic device and method for fabricating |
— |
2011-07-19 |
| D616839 |
LED chip |
John Edmond, David B. Slater, Jr., Amber Christine Salter, James Ibbetson, Bernd Keller |
2010-06-01 |
| D602450 |
LED chip |
John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more |
2009-10-20 |
| D593968 |
LED chip |
John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more |
2009-06-09 |
| D583338 |
LED chip |
John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more |
2008-12-23 |
| D582865 |
LED chip |
John Edmond, David B. Slater, Jr., Amber Christine Salter, James Ibbetson, Bernd Keller |
2008-12-16 |
| D582866 |
LED chip |
John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more |
2008-12-16 |