Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10873002 | Permanent wafer bonding using metal alloy preform discs | — | 2020-12-22 |
| 10211296 | P-doping of group-III-nitride buffer layer structure on a heterosubstrate | Stephan Lutgen, Saad Murad | 2019-02-19 |
| 10199360 | Wire bond free wafer level LED | Bernd Keller, Nicholas W. Medendorp, Jr., James Ibbetson, Max Batres | 2019-02-05 |
| 10026814 | P-doping of group-III-nitride buffer layer structure on a heterosubstrate | Stephan Lutgen, Saad Murad | 2018-07-17 |
| 9786744 | P-doping of group-III-nitride buffer layer structure on a heterosubstrate | Stephan Lutgen, Saad Murad | 2017-10-10 |
| 9634191 | Wire bond free wafer level LED | Bernd Keller, Nicholas W. Medendorp, Jr., James Ibbetson, Max Batres | 2017-04-25 |
| 9496349 | P-doping of group-III-nitride buffer layer structure on a heterosubstrate | Stephan Lutgen, Saad Murad | 2016-11-15 |
| 9368428 | Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management | James Ibbetson | 2016-06-14 |
| 9196799 | LED chips having fluorescent substrates with microholes and methods for fabricating | Bernd Keller | 2015-11-24 |
| 9159888 | Wafer level phosphor coating method and devices fabricated utilizing method | James Ibbetson, Bernd Keller, David T. Emerson, John Edmond, Michael John Bergmann +6 more | 2015-10-13 |
| 9024349 | Wafer level phosphor coating method and devices fabricated utilizing method | James Ibbetson, Arpan Chakraborty, Eric Tarsa, Bernd Keller, James Seruto +1 more | 2015-05-05 |
| 8877524 | Emission tuning methods and devices fabricated utilizing methods | John Edmond, Jeffrey Carl Britt, Bernd Keller, David T. Emerson, Michael John Bergmann +1 more | 2014-11-04 |
| 8878219 | Flip-chip phosphor coating method and devices fabricated utilizing method | James Ibbetson, Bernd Keller | 2014-11-04 |
| 8617997 | Selective wet etching of gold-tin based solder | — | 2013-12-31 |
| 8021904 | Ohmic contacts to nitrogen polarity GaN | — | 2011-09-20 |
| 7982363 | Bulk acoustic device and method for fabricating | — | 2011-07-19 |
| D616839 | LED chip | John Edmond, David B. Slater, Jr., Amber Christine Salter, James Ibbetson, Bernd Keller | 2010-06-01 |
| D602450 | LED chip | John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more | 2009-10-20 |
| D593968 | LED chip | John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more | 2009-06-09 |
| D583338 | LED chip | John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more | 2008-12-23 |
| D582865 | LED chip | John Edmond, David B. Slater, Jr., Amber Christine Salter, James Ibbetson, Bernd Keller | 2008-12-16 |
| D582866 | LED chip | John Edmond, James Ibbetson, Michael John Bergmann, Amber Christine Salter, David T. Emerson +2 more | 2008-12-16 |