Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666772 | High powered light emitter packages with compact optics | James Ibbetson, Bernd Keller | 2017-05-30 |
| 8878209 | High efficiency group III nitride LED with lenticular surface | John Edmond, David B. Slater, Jr., Matthew Donofrio | 2014-11-04 |
| 8759868 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | Mark Raffetto, Kevin Haberern, Michael John Bergmann, David T. Emerson, James Ibbetson +1 more | 2014-06-24 |
| 8692267 | High efficiency Group III nitride LED with lenticular surface | John Edmond, David B. Slater, Jr., Matthew Donofrio | 2014-04-08 |
| 8183588 | High efficiency group III nitride LED with lenticular surface | John Edmond, David B. Slater, Jr., Matthew Donofrio | 2012-05-22 |
| 8174037 | High efficiency group III nitride LED with lenticular surface | John Edmond, David B. Slater, Jr., Matthew Donofrio | 2012-05-08 |
| 8154039 | High efficiency group III nitride LED with lenticular surface | John Edmond, David B. Slater, Jr., Matthew Donofrio | 2012-04-10 |
| 8089090 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | Mark Raffetto, Kevin Haberern, Michael John Bergmann, David T. Emerson, James Ibbetson +1 more | 2012-01-03 |
| 7679203 | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures | David A. Koester, Randall G. Alley, Rama Venkatasubramanian, Pratima Addepalli, Bing W. Shen +1 more | 2010-03-16 |
| 7608860 | Light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2009-10-27 |
| 7341175 | Bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2008-03-11 |
| 7259033 | Flip-chip bonding of light emitting devices | David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2007-08-21 |
| 7259402 | High efficiency group III nitride-silicon carbide light emitting diode | John Edmond, David B. Slater, Jr. | 2007-08-21 |
| 6888167 | Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2005-05-03 |
| 6747298 | Collets for bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more | 2004-06-08 |