| 9666772 |
High powered light emitter packages with compact optics |
James Ibbetson, Bernd Keller |
2017-05-30 |
$3,002,000 |
| 8878209 |
High efficiency group III nitride LED with lenticular surface |
John Edmond, David B. Slater, Jr., Matthew Donofrio |
2014-11-04 |
$3,190,000 |
| 8759868 |
Ultra-thin ohmic contacts for p-type nitride light emitting devices |
Mark Raffetto, Kevin Haberern, Michael John Bergmann, David T. Emerson, James Ibbetson +1 more |
2014-06-24 |
$12,383,000 |
| 8692267 |
High efficiency Group III nitride LED with lenticular surface |
John Edmond, David B. Slater, Jr., Matthew Donofrio |
2014-04-08 |
$35,250,000 |
| 8183588 |
High efficiency group III nitride LED with lenticular surface |
John Edmond, David B. Slater, Jr., Matthew Donofrio |
2012-05-22 |
$17,715,000 |
| 8174037 |
High efficiency group III nitride LED with lenticular surface |
John Edmond, David B. Slater, Jr., Matthew Donofrio |
2012-05-08 |
$14,865,000 |
| 8154039 |
High efficiency group III nitride LED with lenticular surface |
John Edmond, David B. Slater, Jr., Matthew Donofrio |
2012-04-10 |
$15,139,000 |
| 8089090 |
Ultra-thin ohmic contacts for p-type nitride light emitting devices |
Mark Raffetto, Kevin Haberern, Michael John Bergmann, David T. Emerson, James Ibbetson +1 more |
2012-01-03 |
$30,496,000 |
| 7679203 |
Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
David A. Koester, Randall G. Alley, Rama Venkatasubramanian, Pratima Addepalli, Bing W. Shen +1 more |
2010-03-16 |
|
| 7608860 |
Light emitting devices suitable for flip-chip bonding |
David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more |
2009-10-27 |
$47,079,000 |
| 7341175 |
Bonding of light emitting diodes having shaped substrates |
David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more |
2008-03-11 |
$31,815,000 |
| 7259033 |
Flip-chip bonding of light emitting devices |
David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more |
2007-08-21 |
$9,415,000 |
| 7259402 |
High efficiency group III nitride-silicon carbide light emitting diode |
John Edmond, David B. Slater, Jr. |
2007-08-21 |
$9,415,000 |
| 6888167 |
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more |
2005-05-03 |
$22,231,000 |
| 6747298 |
Collets for bonding of light emitting diodes having shaped substrates |
David B. Slater, Jr., John Edmond, Mark Raffetto, Anwar Mohammed, Peter Scott Andrews +1 more |
2004-06-08 |
$20,991,000 |
