Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461134 | Method for forming source/drain contact structure with chalcogen passivation | Qi Xie, Petri Raisanen, Jacob Woodruff, Jan Willem Maes, Michael Eugene Givens | 2016-10-04 |
| 9245742 | Sulfur-containing thin films | Suvi Haukka, Michael Eugene Givens, Jan Willem Maes, Qi Xie | 2016-01-26 |
| 9190296 | Fabrication method of semiconductor package without chip carrier | Yueh-Ying Tsai, Chien-Ping Huang, Chun-Chi Ke | 2015-11-17 |
| 9177837 | Fabrication method of semiconductor package having electrical connecting structures | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2015-11-03 |
| 8975734 | Semiconductor package without chip carrier and fabrication method thereof | Yueh-Ying Tsai, Chien-Ping Huang, Chun-Chi Ke | 2015-03-10 |
| 8835225 | Method for fabricating quad flat non-leaded semiconductor package | Ching-Chiuan Wei, Yung-Chih Lin | 2014-09-16 |
| 8716861 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2014-05-06 |
| 8624368 | Quad flat non-leaded semiconductor package | Ching-Chiuan Wei, Yung-Chih Lin | 2014-01-07 |
| 8390118 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2013-03-05 |
| 8241967 | Semiconductor package with a support structure and fabrication method thereof | Chien-Ping Huang | 2012-08-14 |
| 7893547 | Semiconductor package with a support structure and fabrication method thereof | Chien-Ping Huang | 2011-02-22 |
| 7679172 | Semiconductor package without chip carrier and fabrication method thereof | Chien-Ping Huang, Yuan LI | 2010-03-16 |
| 7314820 | Carrier-free semiconductor package and fabrication method thereof | Yu-Wei Lin, Chun-Yuan Li, Terry T. Tsai, Yu-Ting Ho | 2008-01-01 |
| 7126229 | Wire-bonding method and semiconductor package using the same | Chin-Teng Hsu, Ming-Chun Laio, Holman Chen, Chun-Yuan Li | 2006-10-24 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure | Guo-Kai Su | 2004-02-24 |
| 6696750 | Semiconductor package with heat dissipating structure | Cha-Yun Yin, Ming-Chun Laio, Chien-Ping Huang | 2004-02-24 |
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chin-Yuan Hung, Chang-Fu Chen | 2002-05-28 |