Issued Patents All Time
Showing 101–120 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6183183 | Dual arm linear hand-off wafer transfer assembly | Dennis L. Goodwin, Eric Wood | 2001-02-06 |
| 6162299 | Multi-position load lock chamber | — | 2000-12-19 |
| 6158951 | Wafer carrier and method for handling of wafers with minimal contact | Paul R. Carr, Paul Jacobson, James Kusbel, James S. Roundy, Ravinder Aggarwal | 2000-12-12 |
| 6152074 | Deposition of a thin film on a substrate using a multi-beam source | Marc Schweitzer, Barry Chin | 2000-11-28 |
| 6121061 | Method of processing wafers with low mass support | Franciscus Bernardus Maria Van Bilsen, Jason Layton | 2000-09-19 |
| 6113698 | Degassing method and apparatus | Dan Marohl | 2000-09-05 |
| 6108937 | Method of cooling wafers | — | 2000-08-29 |
| 6068441 | Substrate transfer system for semiconductor processing equipment | Loren Jacobs, Mike Halpin, Jim Alexander, Ken O'Neill, Dennis L. Goodwin | 2000-05-30 |
| 6039074 | Pressure-induced shut-off valve for a liquid delivery system | Chris W. Burkhart, David Christensen, Michael N. Susoeff | 2000-03-21 |
| 6013159 | Particle trap in a magnetron sputtering chamber | Bret W. Adams | 2000-01-11 |
| 5989999 | Construction of a tantalum nitride film on a semiconductor wafer | Timothy E. Levine, Ling Chen, Mei Chang, Roderick C. Mosely, Karl A. Littau | 1999-11-23 |
| 5827408 | Method and apparatus for improving the conformality of sputter deposited films | — | 1998-10-27 |
| 5755936 | Temperature clamped anti-contamination and collimating devices for thin film processes | — | 1998-05-26 |
| 5725740 | Adhesion layer for tungsten deposition | — | 1998-03-10 |
| 5598622 | Temperature clamping method for anti-contamination and collimating devices for thin film processes | — | 1997-02-04 |
| 5460689 | High pressure plasma treatment method and apparatus | Jaim Nulman | 1995-10-24 |
| 5431799 | Collimation hardware with RF bias rings to enhance sputter and/or substrate cavity ion generation efficiency | Roderick C. Mosely, Hiroji Hanawa | 1995-07-11 |
| 5419029 | Temperature clamping method for anti-contamination and collimating devices for thin film processes | — | 1995-05-30 |
| 5040049 | Semiconductor device and method of manufacturing a semiconductor device | — | 1991-08-13 |
| 4908331 | Method of manufacturing a semiconductor device by depositing metal on semiconductor maintained at temperature to form silicide | — | 1990-03-13 |