Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790140 | High deposition rate and high quality nitride | Deenesh Padhi, Masaki Ogata, Yinan Zhang, Shaunak Mukherjee | 2020-09-29 |
| 10700087 | Multi-layer stacks for 3D NAND extendibility | Deenesh Padhi, Er-Xuan Ping, Srinivas Guggilla | 2020-06-30 |
| 10553427 | Low dielectric constant oxide and low resistance OP stack for 3D NAND application | Kang Sub Yim, Zhijun Jiang, Deenesh Padhi | 2020-02-04 |
| 10490467 | Methods of forming a stack of multiple deposited semiconductor layers | Liyan Miao, Chentsau Ying, Long-Shih Lin | 2019-11-26 |
| 10483282 | VNAND tensile thick TEOS oxide | Michael Wenyoung Tsiang, Praket P. Jha, Bok Hoen Kim, Sang Hyuk Kim, Myung Hun Ju +8 more | 2019-11-19 |
| 10475644 | Dielectric-metal stack for 3D flash memory application | Nagarajan Rajagopalan, Sung Hyun Hong, Bok Hoen Kim, Mukund Srinivasan | 2019-11-12 |
| 10276353 | Dual-channel showerhead for formation of film stacks | Kaushik Alayavalli, Praket P. Jha, Masaki Ogata, Zhijun Jiang, Allen Ko +6 more | 2019-04-30 |
| 10246772 | Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices | Praket P. Jha, Allen Ko, Thomas Jongwan Kwon, Bok Hoen Kim, Byung Ho Kil +2 more | 2019-04-02 |
| 10199388 | VNAND tensile thick TEOS oxide | Michael Wenyoung Tsiang, Praket P. Jha, Bok Hoen Kim, Sang Hyuk Kim, Myung Hun Ju +8 more | 2019-02-05 |
| 10060032 | PECVD process | Nagarajan Rajagopalan, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang, Juan Carlos Rocha-Alvarez +17 more | 2018-08-28 |
| 10030306 | PECVD apparatus and process | Nagarajan Rajagopalan, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang, Juan Carlos Rocha-Alvarez +17 more | 2018-07-24 |
| 10002745 | Plasma treatment process for in-situ chamber cleaning efficiency enhancement in plasma processing chamber | Lin Zhang, Xuesong Lu, Andrew V. LE, Jang Seok OH | 2018-06-19 |
| 9972487 | Dielectric-metal stack for 3D flash memory application | Nagarajan Rajagopalan, Sung Hyun Hong, Bok Hoen Kim, Mukund Srinivasan | 2018-05-15 |
| 9816187 | PECVD process | Nagarajan Rajagopalan, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang, Juan Carlos Rocha-Alvarez +17 more | 2017-11-14 |
| 9490116 | Gate stack materials for semiconductor applications for lithographic overlay improvement | Michael Wenyoung Tsiang, Praket P. Jha, Nagarajan Rajagopalan, Bok Hoen Kim, Tsutomu Kiyohara +1 more | 2016-11-08 |
| 9458537 | PECVD process | Nagarajan Rajagopalan, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang, Juan Carlos Rocha-Alvarez +17 more | 2016-10-04 |
| 9157730 | PECVD process | Nagarajan Rajagopalan, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang, Juan Carlos Rocha-Alvarez +17 more | 2015-10-13 |
| 8563095 | Silicon nitride passivation layer for covering high aspect ratio features | Nagarajan Rajagopalan, Ryan Yamase, Ji Ae Park, Shamik Patel, Thomas Nowak +5 more | 2013-10-22 |
| 8298887 | High mobility monolithic p-i-n diodes | Nagarajan Rajagopalan, Ji Ae Park, Bencherki Mebarki, Heung Lak Park, Bok Hoen Kim | 2012-10-30 |
| 8076250 | PECVD oxide-nitride and oxide-silicon stacks for 3D memory application | Nagarajan Rajagopalan, Ji Ae Park, Tsutomu Kiyohara, Sohyun Park, Bok Hoen Kim | 2011-12-13 |