Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068159 | Methods and apparatus for mask patterning debris removal | Karthik Balakrishnan, Arunkumar TATTI, Sriskantharajah Thirunavukarasu, Eng Sheng Peh | 2024-08-20 |
| 11901232 | Automatic kerf offset mapping and correction system for laser dicing | Karthik Balakrishnan, Zavier Zai Yeong Tan, Sai Abhinand, James S. Papanu | 2024-02-13 |
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Zavier Zai Yeong Tan, Karthik Balakrishnan, James S. Papanu, Wei-Sheng Lei | 2023-12-26 |
| 11342226 | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process | Karthik Balakrishnan, Sriskantharajah Thirunavukarasu, Eng Sheng Peh | 2022-05-24 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar | 2022-01-04 |
| 11011424 | Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process | Zavier Zai Yeong Tan, James S. Papanu | 2021-05-18 |
| 10903121 | Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process | Karthik Balakrishnan, James S. Papanu | 2021-01-26 |
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Ajay Kumar, Brad Eaton | 2020-05-26 |
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | James S. Papanu, Ajay Kumar, Wei-Sheng Lei | 2020-01-14 |
| 10363629 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Ajay Kumar, Brad Eaton | 2019-07-30 |
| 9972575 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar | 2018-05-15 |
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2017-12-26 |
| 9768014 | Wafer coating | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2017-09-19 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Brad Eaton, Ajay Kumar, James S. Papanu, Prabhat Kumar | 2017-03-21 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-05-31 |
| 9349648 | Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-05-24 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Brad Eaton, Ajay Kumar, James S. Papanu | 2016-03-29 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-03-08 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-01-26 |
| 9196536 | Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-11-24 |
| 9177861 | Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-11-03 |
| 9165832 | Method of die singulation using laser ablation and induction of internal defects with a laser | James S. Papanu, Wei-Sheng Lei, Alexander Lerner, Brad Eaton, Ajay Kumar | 2015-10-20 |
| 9130030 | Baking tool for improved wafer coating process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9105710 | Wafer dicing method for improving die packaging quality | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2015-08-11 |
| 9038483 | Wireless passive radio-frequency strain and displacement sensors | Ramaswamy Nagarajan, Sharavanan Balasubramaniam, Mario J. Cazeca, Shivshankar Sivasubramanian, Joey L. Mead +1 more | 2015-05-26 |