Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9012305 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-04-21 |
| 8991329 | Wafer coating | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-03-31 |