Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209084 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-12-08 |
| 9196536 | Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-11-24 |
| 9177861 | Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-11-03 |
| 9165832 | Method of die singulation using laser ablation and induction of internal defects with a laser | Wei-Sheng Lei, Jungrae Park, Alexander Lerner, Brad Eaton, Ajay Kumar | 2015-10-20 |
| 9159624 | Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-10-13 |
| 9130030 | Baking tool for improved wafer coating process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9130056 | Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing | James M. Holden, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9130057 | Hybrid dicing process using a blade and laser | Prabhat Kumar, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9093518 | Singulation of wafers having wafer-level underfill | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-07-28 |
| 9076860 | Residue removal from singulated die sidewall | Wei-Sheng Lei, Prabhat Kumar, Ajay Kumar, Brad Eaton | 2015-07-07 |
| 9041198 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-05-26 |
| 9012305 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean | Wei-Sheng Lei, Jungrae Park, Brad Eaton, Ajay Kumar | 2015-04-21 |
| 8991329 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-03-31 |
| 8975163 | Laser-dominated laser scribing and plasma etch hybrid wafer dicing | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-03-10 |
| 8932939 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-01-13 |
| 8927393 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-01-06 |
| 8912078 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2014-12-16 |
| 8883615 | Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes | James M. Holden, Wei-Sheng Lei, Ajay Kumar | 2014-11-11 |
| 8361835 | Method for forming transparent conductive oxide | Valery V. Komin, Hien Minh Le, David Tanner, Philip A. Greene, Suresh Shrauti +2 more | 2013-01-29 |
| 8318589 | Method for forming transparent conductive oxide | Valery V. Komin, Hien Minh Le, David Tanner, Philip A. Greene, Suresh Shrauti +2 more | 2012-11-27 |
| 8002899 | Method and apparatus for mask pellicle adhesive residue cleaning | Banqiu Wu, Richard Lee, M. Rao Yalamanchili, Ajay Kumar, Chung Huan Jeon | 2011-08-23 |
| 7914623 | Post-ion implant cleaning for silicon on insulator substrate preparation | Han-Wen Chen, Brian J. Brown, Steven Verhaverbeke | 2011-03-29 |
| 7846347 | Method for removing a halogen-containing residue | Mark Kawaguchi, Scott Williams, Matthew F. Davis | 2010-12-07 |
| 7718009 | Cleaning submicron structures on a semiconductor wafer surface | Steven Verhaverbeke, Jianshe Tang, Roman Gouk, Brian J. Brown, Han-Wen Chen +2 more | 2010-05-18 |
| 7694688 | Wet clean system design | Paul Lester, Scott Meyer, Wyland L. Atkins, Douglas Richards, Constantin Predoaica +6 more | 2010-04-13 |