Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039958 | Semiconductor device including a reduced stress configuration for metal pillars | Alexander Platz, Matthias Lehr | 2011-10-18 |
| 7993936 | System and method for controlling an electrochemical etch process | Kerstin Siury, Niels Rackwitz, Joern Schnapke | 2011-08-09 |
| 7897433 | Semiconductor chip with reinforcement layer and method of making the same | Michael Z. Su, Jaime Bravo | 2011-03-01 |
| 7833839 | Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature | Maxat Touzelbaev, Raj N. Master | 2010-11-16 |
| 7829453 | Method for forming solder balls with a stable oxide layer by controlling the reflow ambient | Gotthard Jungnickel, Alexander Platz | 2010-11-09 |
| 7678615 | Semiconductor device with gel-type thermal interface material | Maxat Touzelbaev, Raj N. Master | 2010-03-16 |
| 7585759 | Technique for efficiently patterning an underbump metallization layer using a dry etch process | Alexander Platz, Gotthard Jungnickel, Kerstin Siury | 2009-09-08 |
| 7569937 | Technique for forming a copper-based contact layer without a terminal metal | Matthias Lehr, Gotthard Jungnickel | 2009-08-04 |
| 7491556 | Efficient method of forming and assembling a microelectronic chip including solder bumps | Gotthard Jungnickel, Daniel Richter, Marcel Wieland | 2009-02-17 |
| 7375032 | Semiconductor substrate thinning method for manufacturing thinned die | Frank Seliger, Matthias Lehr, Marcel Wieland, Lothar Mergili | 2008-05-20 |
| 7306976 | Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly | Frank Feustel, Matthias Lehr | 2007-12-11 |
| 6894390 | Soft error resistant semiconductor device | Gisela Schammler, Mathias Bottcher, Daniel Gehre, Ehrenfried Zschech | 2005-05-17 |
| 6639314 | Solder bump structure and a method of forming the same | Mathias Boettcher, Gisela Schammler | 2003-10-28 |