Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6639314 | Solder bump structure and a method of forming the same | Gisela Schammler, Frank Kuechenmeister | 2003-10-28 | $6,461,000 |
| 6306748 | Bump scrub after plating | — | 2001-10-23 | $2,669,000 |
| 6191479 | Decoupling capacitor configuration for integrated circuit chip | Dennis J. Herrell | 2001-02-20 | $7,201,000 |
| 6162718 | High speed bump plating/forming | — | 2000-12-19 | $3,857,000 |