Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Decoupling capacitor configuration for integrated circuit chip

Decoupling capacitor configuration for integrated circuit chip

US Patent 6191479 · Granted Feb 20, 2001

Estimated economic value: $7,201,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low inductance power distribution system for an integrated circuit chip2012
Crosstalk cancellation for integrated circuit package configuration2005
Low inductance power distribution system for an integrated circuit chip2004
Solder bump structure and a method of forming the same2003
Integrated circuit carrier arrangement for reducing non-uniformity in current fl2002
Arrangement for reducing non-uniformity in current flow through various power pi2002
Bump scrub after plating2001
High speed bump plating/forming2000
Power surge management for high performance integrated circuit1999
Diaphragm sealing apparatus1992
Electrical beam switch1991
Low pressure high heat transfer fluid heat exchanger1991