| 6642152 |
Method for ultra thin resist linewidth reduction using implantation |
Che-Hoo Ng, Scott A. Bell, Christopher Lee Pike |
2003-11-04 |
| 6387820 |
BC13/AR chemistry for metal overetching on a high density plasma etcher |
— |
2002-05-14 |
| 6333263 |
Method of reducing stress corrosion induced voiding of patterned metal layers |
Minh Van Ngo, Simon S. Chan, King Wai Kelwin Ko |
2001-12-25 |
| 6297065 |
Method to rework device with faulty metal stack layer |
Jiahua Huang, Pei-Yuan Gao |
2001-10-02 |
| 6274504 |
Minimizing metal corrosion during post metal solvent clean |
Jacques Bertrand |
2001-08-14 |
| 6251776 |
Plasma treatment to reduce stress corrosion induced voiding of patterned metal layers |
Minh Van Ngo, Simon S. Chan, King Wai Kelwin Ko |
2001-06-26 |
| 6174819 |
Low temperature photoresist removal for rework during metal mask formation |
Jeffrey A. Shields, Lewis Shen |
2001-01-16 |
| 6159863 |
Insitu hardmask and metal etch in a single etcher |
Susan H. Chen, Judi Quan Rizzuto |
2000-12-12 |
| 6066546 |
Method to minimize particulate induced clamping failures |
Jeffrey A. Shields |
2000-05-23 |