Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Minimizing metal corrosion during post metal solvent clean

Minimizing metal corrosion during post metal solvent clean

US Patent 6274504 · Granted Aug 14, 2001

Estimated economic value: $3,163,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Trenches to reduce lateral silicide growth in integrated circuit technology2006
Two-step process for nickel deposition2005
Effect of substrate surface treatment on 193 NM resist processing2004
Titanium barrier for nickel silicidation of a gate electrode2004
Two-step process for nickel deposition2004
Method for ultra thin resist linewidth reduction using implantation2003
Two-step process for nickel deposition2003
Stacked double sidewall spacer oxide over nitride2003
Method of forming nickel silicide using a one-step rapid thermal anneal process 2003
Process for forming fully silicided gates2003
Cobalt barrier for nickel silicidation of a gate electrode2003
Nickel silicide process using starved silicon diffusion barrier2003