Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6726545 | Linear polishing for improving substrate uniformity | Subramanian Balakumar, Chen Feng, Paul Proctor, Mukhopadhyay Madhusudan, Chivukula Subrahmanyam +1 more | 2004-04-27 |
| 6673695 | STI scheme to prevent fox recess during pre-CMP HF dip | Paul Proctor | 2004-01-06 |
| 6663472 | Multiple step CMP polishing | Chen Feng, Subramanian Balakumar, Paul Proctor | 2003-12-16 |
| 6649517 | Copper metal structure for the reduction of intra-metal capacitance | Young Way Teh, Ting Cheong Ang | 2003-11-18 |
| 6531386 | Method to fabricate dish-free copper interconnects | Simon Chooi, Randall Cher Liang Cha | 2003-03-11 |
| 6472697 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Wang Ling Goh | 2002-10-29 |
| 6406975 | Method for fabricating an air gap shallow trench isolation (STI) structure | Young Way Teh, Ting Cheong Ang, Alex See, Yong Kong Siew | 2002-06-18 |
| 6403484 | Method to achieve STI planarization | Lap Chan, James Yong Meng Lee, Chen Feng, Wang Ling Goh | 2002-06-11 |
| 6399471 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Wang Ling Goh | 2002-06-04 |
| 6376376 | Method to prevent CU dishing during damascene formation | Feng Chen, Wang Ling Goh | 2002-04-23 |