Issued Patents All Time
Showing 51–75 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037919 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2021-06-15 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2021-05-18 |
| 10998292 | Offset pads over TSV | Bongsub Lee | 2021-05-04 |
| 10964664 | DBI to Si bonding for simplified handle wafer | Chandrasekhar Mandalapu, Gaius Gillman Fountain, Jr. | 2021-03-30 |
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Laura Wills Mirkarimi | 2020-09-29 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10707087 | Processing stacked substrates | Cyprian Emeka Uzoh | 2020-07-07 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Arkalgud R. Sitaram | 2020-04-14 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang | 2020-03-10 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Liang Wang | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2019-12-17 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Liang Wang | 2019-06-25 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Liang Wang | 2019-06-18 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2019-04-09 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-01-08 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Liang Wang | 2019-01-08 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Arkalgud R. Sitaram | 2019-01-08 |
| 9991231 | Stacked die integrated circuit | Charles G. Woychik, Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2018-04-17 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Arkalgud R. Sitaram | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Bongsub Lee, Scott McGrath, Hong Shen, Charles G. Woychik +2 more | 2018-01-02 |