Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9818668 | Thermal vias disposed in a substrate without a liner layer | — | 2017-11-14 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Charles G. Woychik | 2017-11-07 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2017-08-22 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2017-08-22 |
| 9735084 | Bond via array for thermal conductivity | Rajesh Katkar, Charles G. Woychik, Wael Zohni | 2017-08-15 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2017-06-27 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Liang Wang, Hong Shen, Rajesh Katkar, Belgacem Haba | 2017-05-30 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Charles G. Woychik | 2016-10-25 |
| 9418924 | Stacked die integrated circuit | Charles G. Woychik, Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster | 2016-08-16 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2016-07-19 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Arkalgud R. Sitaram | 2016-06-21 |
| 9299572 | Thermal vias disposed in a substrate without a liner layer | — | 2016-03-29 |
| 8804296 | System and method for in-situ conditioning of emitter electrode with silver | Kenneth Honer, Matthew K. Schwiebert, Nels Jewell-Larsen | 2014-08-12 |
| 8759973 | Microelectronic assemblies having compliancy and methods therefor | Vage Oganesian, Belgacem Haba, David Ovrutsky | 2014-06-24 |
| 8482898 | Electrode conditioning in an electrohydrodynamic fluid accelerator device | Ken Honer, Nels Jewell-Larsen | 2013-07-09 |
| 8378487 | Wafer level chip package and a method of fabricating thereof | Teck-Gyu Kang, Belgacem Haba | 2013-02-19 |
| 8269319 | Collective and synergistic MRAM shields | Kenneth Honer, William Walter Carlson, Michael Warner | 2012-09-18 |
| 8133808 | Wafer level chip package and a method of fabricating thereof | Teck-Gyu Kang, Belgacem Haba | 2012-03-13 |
| 8115308 | Microelectronic assemblies having compliancy and methods therefor | Vage Oganesian, Belgacem Haba, David Ovrutsky | 2012-02-14 |
| 8053281 | Method of forming a wafer level package | Kenneth Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein | 2011-11-08 |
| 7749886 | Microelectronic assemblies having compliancy and methods therefor | Vage Oganesian, Belgacem Haba, David Ovrutsky | 2010-07-06 |
| 7719121 | Microelectronic packages and methods therefor | Giles Humpston, Belgacem Haba | 2010-05-18 |
| 6686665 | Solder pad structure for low temperature co-fired ceramic package and method for making the same | David J. Lewis, Stephen Thomas Murphy | 2004-02-03 |