Issued Patents All Time
Showing 26–50 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Liang Wang | 2024-01-02 |
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11837582 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11791307 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Gaius Gillman Fountain, Jr. | 2023-10-17 |
| 11764189 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11749645 | TSV as pad | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11728313 | Offset pads over TSV | Bongsub Lee | 2023-08-15 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-05-16 |
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Laura Wills Mirkarimi | 2022-11-29 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2022-08-16 |
| 11393779 | Large metal pads over TSV | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2022-06-07 |
| 11348801 | Processing stacked substrates | Cyprian Emeka Uzoh | 2022-05-31 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2022-04-12 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2022-04-05 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2022-02-22 |
| 11244916 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Laura Wills Mirkarimi | 2022-02-08 |
| 11171117 | Interlayer connection of stacked microelectronic components | Belgacem Haba | 2021-11-09 |
| 11169326 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Liang Wang | 2021-11-09 |
| 11158606 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2021-10-26 |
| 11114408 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Liang Wang | 2021-09-07 |
| 11056390 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2021-07-06 |