Issued Patents 2025
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2025-03-18 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2025-02-18 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2025-02-11 |
| 12218020 | Semiconductor packages | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2025-02-04 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2025-01-28 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12193168 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2025-01-07 |