Issued Patents 2024
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2024-12-24 |
| 12176247 | Metal oxide composite as etch stop layer | Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Cherng-Shiaw Tsai, Kuang-Wei YANG, Hsiaokang CHANG +1 more | 2024-10-29 |
| 12125795 | Integrated chip with inter-wire cavities | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao +2 more | 2024-10-22 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai +3 more | 2024-09-17 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Cheng-Chin Lee, Shao-Kuan Lee, Hsiao-Kang Chang, Shau-Lin Shue | 2024-09-17 |
| 12074084 | Heat dispersion layers for double sided interconnect | Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang, Cherng-Shiaw Tsai | 2024-08-27 |
| 12074060 | Semiconductor device structure and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsiaokang CHANG +1 more | 2024-08-27 |
| 12068193 | Semiconductor device structure with interconnect structure having air gap | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue, Hsiao-Kang Chang | 2024-08-20 |
| 12068248 | Semiconductor interconnection structure and methods of forming the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2024-08-13 |
| 12033889 | Semiconductor device structure and methods of forming the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2024-07-09 |
| 12027606 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Ting-Ya Lo +2 more | 2024-07-02 |
| 12009301 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Yung-Hsu Wu, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12002750 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-04 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-05-21 |
| 11948834 | Selective deposition of barrier layer | Hai-Ching Chen, Shau-Lin Shue | 2024-04-02 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-03-19 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-03-05 |
| 11908794 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu | 2024-02-20 |
| 11908792 | Semiconductor device comprising cap layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-20 |
| 11901221 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-13 |