Issued Patents 2024
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2024-12-24 |
| 12166026 | Semiconductor packages and methods for forming the same | Han-Tang Hung, Shin-Yi Yang, Ming-Han Lee | 2024-12-10 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12159814 | Semiconductor packages and methods for forming the same | Shin-Yi Yang, Ming-Han Lee | 2024-12-03 |
| 12142557 | Integrated chip having a back-side power rail | Shin-Yi Yang, Ming-Han Lee | 2024-11-12 |
| 12136567 | Fully self-aligned interconnect structure | Hsin-Ping Chen, Min Cao | 2024-11-05 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Cherng-Shiaw Tsai, Kuang-Wei YANG, Hsin-Yen Huang +1 more | 2024-10-29 |
| 12113021 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Ming-Han Lee, Hai-Ching Chen | 2024-10-08 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai +3 more | 2024-09-17 |
| 12094848 | Semiconductor packages and methods for forming the same | Shin-Yi Yang, Ming-Han Lee | 2024-09-17 |
| 12094816 | Semiconductor structure having deep metal line and method for forming the semiconductor structure | Wei-Chen Chu, Chia-Tien Wu, Chia-Wei Su, Yu-Chieh Liao, Chia-Chen Lee +1 more | 2024-09-17 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Cheng-Chin Lee, Shao-Kuan Lee, Hsin-Yen Huang, Hsiao-Kang Chang | 2024-09-17 |
| 12080593 | Barrier-less structures | Hsin-Ping Chen, Ming-Han Lee, Shin-Yi Yang, Yung-Hsu Wu, Chia-Tien Wu +1 more | 2024-09-03 |
| 12074084 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai | 2024-08-27 |
| 12074060 | Semiconductor device structure and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsin-Yen Huang +1 more | 2024-08-27 |
| 12068248 | Semiconductor interconnection structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-08-20 |
| 12068254 | Interconnection structure and methods of forming the same | Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-08-20 |
| 12068193 | Semiconductor device structure with interconnect structure having air gap | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiao-Kang Chang | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2024-08-13 |
| 12051683 | Semiconductor packages and methods for forming the same | Han-Tang Hung, Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 12033889 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-07-09 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Hai-Ching Chen | 2024-06-11 |
| 12009301 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen | 2024-06-11 |
| 12002750 | Interconnect structure | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen | 2024-06-04 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-06-04 |