Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113021 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Ming-Han Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-10-08 |
| 12068253 | Semiconductor structure with two-dimensional conductive structures | Shu-Wei Li, Meng-Pei Lu, Shin-Yi Yang, Ming-Han Lee | 2024-08-20 |
| 12068254 | Interconnection structure and methods of forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2024-08-20 |
| 12051645 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 12027419 | Semiconductor device including liner structure | Ching-Fu Yeh, Guanyu Luo, Meng-Pei Lu, Chao-Hsien Peng, Shin-Yi Yang +2 more | 2024-07-02 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Chin-Lung Chung, Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |
| 11908794 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Meng-Pei Lu | 2024-02-20 |