Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051643 | Hybrid via interconnect structure | Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 11978663 | Integrated circuit interconnect structure having discontinuous barrier layer and air gap | Shin-Yi Yang, Ming-Han Lee | 2024-05-07 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |