Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068253 | Semiconductor structure with two-dimensional conductive structures | Yu-Chen Chan, Meng-Pei Lu, Shin-Yi Yang, Ming-Han Lee | 2024-08-20 |
| 12068254 | Interconnection structure and methods of forming the same | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2024-08-20 |
| 12062612 | Semiconductor device structure and methods of forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2024-08-13 |
| 12051645 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Chin-Lung Chung, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |