Issued Patents 2024
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2024-12-24 |
| 12176247 | Metal oxide composite as etch stop layer | Kai-Fang Cheng, Chi-Lin Teng, Hsin-Yen Huang | 2024-12-24 |
| 12154965 | Carrier barrier layer for tuning a threshold voltage of a ferroelectric memory device | Rainer Yen-Chieh Huang, Yu-Ming Lin, Chung-Te Lin | 2024-11-26 |
| 12150309 | Double gate metal-ferroelectric-metal-insulator-semiconductor field-effect transistor (MFMIS-FET) structure | Yen-Chieh Huang, Po-Ting Lin, Song-Fu Liao, Sai-Hooi Yeong, Yu-Ming Lin +1 more | 2024-11-19 |
| 12144259 | Organic gate TFT-type stress sensors and method of making and using the same | Yen-Chieh Huang | 2024-11-12 |
| 12127411 | Cocktail layer over gate dielectric layer of FET FeRAM | Rainer Yen-Chieh Huang, Chung-Te Lin | 2024-10-22 |
| 12119402 | Semiconductor devices with ferroelectric layer and methods of manufacturing thereof | Yen-Chieh Huang, Po-Ting Lin, Sai-Hooi Yeong, Yu-Ming Lin, Chung-Te Lin | 2024-10-15 |
| 12113021 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Ming-Han Lee, Shau-Lin Shue | 2024-10-08 |
| 12114507 | Capping layer over FET FeRAM to increase charge mobility | Rainer Yen-Chieh Huang, Chung-Te Lin | 2024-10-08 |
| 12113115 | Thin film transistor including a compositionally-graded gate dielectric and methods for forming the same | Wu-Wei Tsai, Chun-Chieh Lu, Yu-Ming Lin, Sai-Hooi Yeong | 2024-10-08 |
| 12094935 | Method of selective film deposition and semiconductor feature made by the method | Song-Fu Liao, Chung-Te Lin | 2024-09-17 |
| 12089415 | Metal layers for increasing polarization of ferroelectric memory device | Yen-Chieh Huang, Chung-Te Lin | 2024-09-10 |
| 12040409 | Thin film transistor including a dielectric diffusion barrier and methods for forming the same | Wu-Wei Tsai, Sai-Hooi Yeong, Yu-Ming Lin | 2024-07-16 |
| 12027601 | Method for forming semiconductor structure | Yen-Chieh Huang, Yu-Ming Lin, Chung-Te Lin | 2024-07-02 |
| 12027606 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Ting-Ya Lo +2 more | 2024-07-02 |
| 12009301 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Shau-Lin Shue | 2024-06-11 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Shau-Lin Shue | 2024-06-11 |
| 12002750 | Interconnect structure | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Shau-Lin Shue | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-05-21 |
| 11984316 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Tien-I Bao | 2024-05-14 |
| 11984508 | Thin film transistor including a compositionally-modulated active region and methods for forming the same | Wu-Wei Tsai, Po-Ting Lin, Chung-Te Lin | 2024-05-14 |
| 11955561 | Carrier modification devices for avoiding channel length reduction and methods for fabricating the same | Wu-Wei Tsai | 2024-04-09 |
| 11948834 | Selective deposition of barrier layer | Hsin-Yen Huang, Shau-Lin Shue | 2024-04-02 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Shau-Lin Shue | 2024-03-19 |
| 11917831 | Annealed seed layer to improve ferroelectric properties of memory layer | Song-Fu Liao, Rainer Yen-Chieh Huang, Chung-Te Lin | 2024-02-27 |