Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142521 | Interconnect structure and semiconductor device having the same | Tung Ying Lee, Yu-Chao Lin | 2024-11-12 |
| 12094771 | Interconnect structure and method | Yu-Chao Lin, Tung Ying Lee | 2024-09-17 |
| 11984316 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2024-05-14 |
| 11957070 | Semiconductor device, memory cell and method of forming the same | Tung Ying Lee, Shao-Ming Yu, Yu-Chao Lin | 2024-04-09 |