Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170199 | Cyclic spin-on coating process for forming dielectric material | Je-Ming Kuo, Yen-Chun Huang, Chih-Tang Peng | 2024-12-17 |
| 12087861 | FinFETs and methods of forming FinFETs | Chin-Hsiang Lin, Tai-Chun Huang | 2024-09-10 |
| 11984316 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Hai-Ching Chen | 2024-05-14 |
| 11955376 | Etch damage and ESL free dual damascene metal interconnect | Sunil Kumar Singh, Chung-Ju Lee | 2024-04-09 |
| 11929258 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee +1 more | 2024-03-12 |