Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955376 | Etch damage and ESL free dual damascene metal interconnect | Chung-Ju Lee, Tien-I Bao | 2024-04-09 |
| 11901304 | Integrated circuit structure with fluorescent material, and related methods | Vibhor Jain, Siva P. Adusumilli, Sebastian T. Ventrone, Johnatan A. Kantarovsky, Yves T. Ngu | 2024-02-13 |