Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176247 | Metal oxide composite as etch stop layer | Chi-Lin Teng, Hsin-Yen Huang, Hai-Ching Chen | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12154850 | Semiconductor interconnection structures and methods of forming the same | Hsiao-Kang Chang | 2024-11-26 |
| 12080650 | Interconnect structure with low capacitance and high thermal conductivity | Hsiao-Kang Chang, Ming-Han Lee | 2024-09-03 |
| 11923357 | Semiconductor device structure and methods of forming the same | Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsiaokang CHANG | 2024-03-05 |