Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2024-12-10 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-10-29 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12074084 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang | 2024-08-27 |
| 12074060 | Semiconductor device structure and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-08-27 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2024-08-13 |
| 11923357 | Semiconductor device structure and methods of forming the same | Kai-Fang Cheng, Kuang-Wei YANG, Hsiaokang CHANG | 2024-03-05 |