Issued Patents 2024
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2024-12-10 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cherng-Shiaw Tsai, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-10-29 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Shao-Kuan Lee, Hsin-Yen Huang, Hsiao-Kang Chang, Shau-Lin Shue | 2024-09-17 |
| 12094764 | Interconnect structure and methods of forming the same | Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12074060 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-08-27 |
| 12068248 | Semiconductor interconnection structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2024-08-13 |
| 12033889 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2024-07-09 |
| 12009301 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12002750 | Interconnect structure | Hsin-Yen Huang, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-04 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue +1 more | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue +1 more | 2024-05-21 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-03-19 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue +1 more | 2024-03-05 |
| 11908792 | Semiconductor device comprising cap layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue | 2024-02-20 |
| 11901221 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue | 2024-02-13 |
| 11894266 | Metal capping layer and methods thereof | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2024-02-06 |