Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2024-12-10 |
| 12154850 | Semiconductor interconnection structures and methods of forming the same | Kai-Fang Cheng | 2024-11-26 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Cheng-Chin Lee, Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue | 2024-09-17 |
| 12080650 | Interconnect structure with low capacitance and high thermal conductivity | Kai-Fang Cheng, Ming-Han Lee | 2024-09-03 |
| 12074084 | Heat dispersion layers for double sided interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue, Cherng-Shiaw Tsai | 2024-08-27 |
| 12068193 | Semiconductor device structure with interconnect structure having air gap | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2024-08-13 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-06-04 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-03-05 |