Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080593 | Barrier-less structures | Hsin-Ping Chen, Ming-Han Lee, Shin-Yi Yang, Chia-Tien Wu, Shau-Lin Shue +1 more | 2024-09-03 |
| 12062611 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Hsin-Ping Chen, Cheng-Chi Chuang | 2024-08-13 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 11894238 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu +4 more | 2024-02-06 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su | 2024-01-02 |