Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12058852 | Semiconductor device and method of operating the same | Wei-Chen Chu, Chia-Tien Wu | 2024-08-06 |
| 12051646 | Metal line structure and method | Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2024-07-30 |
| 12002709 | Interconnect structure and manufacturing method for the same | Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang | 2024-06-04 |
| 11901295 | Dielectric film for semiconductor fabrication | Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more | 2024-02-13 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2024-01-02 |