Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183671 | Hybrid metal line structure | Pokuan Ho, Chia-Tien Wu, Hsin-Ping Chen | 2024-12-31 |
| 12094816 | Semiconductor structure having deep metal line and method for forming the semiconductor structure | Chia-Tien Wu, Chia-Wei Su, Yu-Chieh Liao, Chia-Chen Lee, Hsin-Ping Chen +1 more | 2024-09-17 |
| 12058852 | Semiconductor device and method of operating the same | Hsiang-Wei Liu, Chia-Tien Wu | 2024-08-06 |
| 12002709 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Chia-Tien Wu, Tai-I Yang | 2024-06-04 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2024-01-02 |