Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183671 | Hybrid metal line structure | Pokuan Ho, Chia-Tien Wu, Wei-Chen Chu | 2024-12-31 |
| 12136567 | Fully self-aligned interconnect structure | Shau-Lin Shue, Min Cao | 2024-11-05 |
| 12094816 | Semiconductor structure having deep metal line and method for forming the semiconductor structure | Wei-Chen Chu, Chia-Tien Wu, Chia-Wei Su, Yu-Chieh Liao, Chia-Chen Lee +1 more | 2024-09-17 |
| 12094946 | Gate all around device | Yung-Chih Wang, Yu-Chieh Liao, Tai-I Yang | 2024-09-17 |
| 12080593 | Barrier-less structures | Ming-Han Lee, Shin-Yi Yang, Yung-Hsu Wu, Chia-Tien Wu, Shau-Lin Shue +1 more | 2024-09-03 |
| 12062611 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Yung-Hsu Wu, Cheng-Chi Chuang | 2024-08-13 |
| 11984359 | Semiconductor device with spacers for self aligned vias | Pokuan Ho, Chia-Tien Wu | 2024-05-14 |
| 11923306 | Semiconductor structure having air gaps and method for manufacturing the same | Chia-Wei Su, Chia-Tien Wu, Shau-Lin Shue | 2024-03-05 |