Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183671 | Hybrid metal line structure | Chia-Tien Wu, Hsin-Ping Chen, Wei-Chen Chu | 2024-12-31 |
| 11984359 | Semiconductor device with spacers for self aligned vias | Hsin-Ping Chen, Chia-Tien Wu | 2024-05-14 |