Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062611 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Yung-Hsu Wu, Hsin-Ping Chen, Cheng-Chi Chuang | 2024-08-13 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2024-01-02 |