Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125795 | Integrated chip with inter-wire cavities | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai +2 more | 2024-10-22 |
| 12094823 | Interconnection structure and methods of forming the same | Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee | 2024-09-17 |
| 12074059 | Semiconductor arrangement and method of making | Hsi-Wen Tien, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee | 2024-08-27 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee +1 more | 2024-04-30 |
| 11942364 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Yu-Teng Dai | 2024-03-26 |
| 11923293 | Barrier structure on interconnect wire to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai | 2024-03-05 |
| 11915943 | Methods of etching metals in semiconductor devices | Hsi-Wen Tien, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee | 2024-02-27 |