Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12178051 | Magnetic random access memory and manufacturing method thereof | Hui-Hsien Wei, Chung-Te Lin, Han-Ting Tsai, Tai-Yen Peng, Chien-Min Lee +2 more | 2024-12-24 |
| 12125795 | Integrated chip with inter-wire cavities | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao +2 more | 2024-10-22 |
| 12094823 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee | 2024-09-17 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee +1 more | 2024-04-30 |
| 11942364 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Wei-Hao Liao | 2024-03-26 |
| 11923293 | Barrier structure on interconnect wire to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2024-03-05 |